From 400G/800G transceivers to liquid‑cooled switches – complete high‑speed interconnect ecosystem
QSFP-DD, OSFP, LPO and CPO modules for AI clusters and DCI
400G SR8, DR4, FR4, LR4 for data center and DCI. Low latency, high density.
800G 2xFR4, 8x100G, SR8 modules. Ideal for AI back-end networks.
Linear-drive pluggable optics (LPO) reducing power by >50%.
Next‑generation 1.6T modules for ultra‑scale AI clusters.
Active Optical Cables and Direct Attach Copper for rack‑to‑rack and switch‑to‑server links
Active optical cable up to 30m, 800G throughput.
Direct Attach Copper, passive/active, 1‑5m lengths.
High‑density MPO‑12/MPO‑24 AOC for backbone links.
Direct liquid cooling, 51.2T switching, NVIDIA/AMD compatible
128x400G or 64x800G ports, cold plate cooling, PUE<1.1.
8x GPU servers with liquid cooling, high‑speed backplane.
Coolant distribution units, cold plates, quick disconnects.
Single‑phase immersion cooling for high‑density compute.
Seismic racks, cold aisle containment, intelligent power distribution
600/800mm width, seismic rated, cable management.
Outlet‑level control, power metering, environment sensors.
Hot/cold aisle, doors, panels, brush strips.
All‑in‑one micro‑module with cooling, power, racks.
High‑density MPO/MTP trunks, cassettes, ODF for 400G/800G
Pre‑terminated MPO trunks, 12‑144 fibres, polarity A/B/C.
19‑inch ODF frames, splice trays, pigtails, adapters.
Single‑mode / multimode, UPC/APC polish, LSZH.
Campus core switches, DCI platforms with 400G uplinks.
OTDR, power meters, MPO testers, BERT, end‑face inspection